Nvidia is investing billions into tech that could change the AI sector

Nvidia has committed at least $6.5 billion into companies developing photonics technology in the past three months, as the company races to invest in solving one of the major bottlenecks to the rollout of AI.

Photonics, the use of light to transmit data, is an emerging technology considered to be a more efficient alternative to the current process of transferring data using electricity. Electrical data transfer consumes more energy — a factor which is increasingly seen as a blocker to the broader deployment of AI.

Since the beginning of March, Nvidia has announced $2 billion investments into Lumentum, Coherent and Marvell, all of which are developing photonics tech. The chip giant also said it would invest $500 million into Corning to develop advanced optical connectivity solutions, and participated in optics startup Ayer Labs’ $500 million Series E funding round.

“Photonics represents a way for Nvidia to scale their AI infrastructure without the energy costs that staying with electrical and copper will incur,” Alvin Nguyen, senior analyst at Forrester, told CNBC.

“By investing in photonics companies, Nvidia is making sure that advancements in photonics continue and it will prevent them from hitting a scalability and performance wall that will occur if they remain on electrical and copper.”

Solving bottlenecks

Lightelligence CEO: 30% of all data center chips may be photonics in 3-5 years

Nvidia is one of the many AI stakeholders recently making the move to funnel cash into photonics tech.

Chipmaker AMD joined Nvidia in the Ayer Labs round, as well as acquiring startup Enosemi in 2025, alongside making equity investments in Teramount and Celestial AI. Alphabet and Microsoft venture arms backed nEye in an $80 million Series C in April.

But deploying photonics tech across the AI infrastructure stack at scale comes with its own challenges.

“The technology is sound, production scale is the harder problem,” Nick Patience, AI lead at the Futurum Group, told CNBC.

“Manufacturing yield on complex co-packaged optical assemblies remains a challenge because precise alignment of optical and silicon components is unforgiving, and when something goes wrong in the packaging process, the assembly typically can’t be reworked,” he said.

“So the transition is underway, but it’s still early,” Patience added. “I would expect us to see large-scale adoption from 2028 onwards.”

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